Mitigation Technique

Many years of industry experience in ESD control tells us that ESD threat is almost always come from certain location(s) of the manufacturing processes and confined only to a very small locality, the mitigation technique using humid air disclosed and highlighted here can be very specific and startling simple without the need of a high level of knowledge and experience in the subject of ESD control. 

More specifically, the problematic spot(s) is usually a very minor section of a machine or equipment where the tribo-charging of an insulator and a metallic object takes place (In a pick-and-place operations, tribo-charging often takes place between insulators or between insulator and conductor upon separation). 

Most of the time the insulator is a plastic or a ceramics moulding compound of the microchip; and the metallic object is a stainless steel structure where the microchip or a PCB rests or moves on top of it. Static charge mitigation technique always focuses on the insulative materials which by default are attached to the metallic structure of the machine. 

There is no active device mode in the static charge mitigation process. Mitigation process takes place only during passive device mode where there is no live device operations. An example of a good strategy is to treat the device first prior to loading it into the test socket in a device testing operations. In that way, static charge mitigation will not cause any interruption especially to the ongoing device testing operations of the microchip or device manufacturing activity.